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CY7C68013A-56PVXI 产品修订记录 - Cypress Semiconductor（赛普拉斯）
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Cypress Semiconductor（赛普拉斯）
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SSOP-56
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USB 2.0高速外设控制器,EZ-USB FX2LP系列
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CY7C68013A-56PVXI数据手册
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Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel :(408) 943-2600
PRODUCT CHANGE NOTIFICATION
PCN: PCN145351 Date: December 16, 2014
Subject: Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at
JCET China
To: PRICE CONTROL
NEWARK
pricecontrol@newark.com
Change Type: Major
Description of Change:
Cypress announces the qualification of Copper Palladium (CuPd) wire bonds for select lead
frame (LF) products at Jiangsu Changjiang Electronics Technology Co., Ltd (JCET) in China
using the Bill of Materials in the attached table. There will be no changes to product datasheets
or part numbers.
JCET is the largest provider of independent semiconductor manufacturing services for assembly
and test in China. Their assembly facility in Changjiang, China is already a qualified assembly
site for Cypress products using CuPd wire bonds. JCET is certified to several international
quality standards: ISO/TS16949:2009, ANSI/ESD S20.20:2007, IECQ QC 080000:2005, ISO
14001 and OHSAS 18001.
Benefit of Change:
The conversion to CuPd wire bonds will keep Cypress in alignment with the overall industry
trend towards copper palladium wire bonds. The goal of the manufacturing initiative is to provide
the means for Cypress to continue to meet our customers’ requirements and meet our delivery
commitments through dynamic, changing market conditions.
Affected Part Numbers: 128
Affected Parts: See the attached file for a list of all part numbers affected by this change. Note
that any new lead frame parts in these packages that are introduced after the publication of this
PCN will also be manufactured with either CuPd or gold wire bonds.
Document No. 001-12089 Rev. *F Page 1 of 3
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