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198 Champion Court San Jose, CA 95134-1709 (408) 943-2600
PRODUCT CHANGE NOTIFICATION
PCN: PCN135246 Date: September 14, 2013
Subject: Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and
Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller
Product families.
To: PCN ADMINISTRATOR
CYPRESS PCN ADMIN
pcn_adm@cypress.com
Change Type: Major
Description of Change:
Cypress announces the qualification of an alternate wafer fabrication site, Cypress’s in-house
wafer manufacturing facility, Cypress Minnesota Inc. (CMI), for select PSoC Capsense
Controller Product families (CY8C20xx7 & CY8C20055).
This product will run on SONOS8 process technology, which has been previously qualified at
CMI to support production quantities. The SONOS8 technology is also qualified at Cypress’s
subcontractor site Grace Semiconductor Manufacturing Corporation (GSMC).
Effective 90 days from the date of this notification, shipments may be sourced from any qualified
manufacturing site, i.e., CMI and GSMC.
Cypress also announces the qualification of Copper Palladium (CuPd) as an alternate wire bond
option to Gold (Au) in 16QFN package for select PSoC Capsense Controller Product families.
Effective 90 days from the date of this notification, shipments may be sourced from any qualified
assembly site, i.e., Advanced Semiconductor Engineering (ASE) and Cypress Manufacturing
Ltd. (CML).
Benefit of Change:
Cypress will have the added capability to meet varying market demand, and to ensure
consistent and reliable delivery performance to customers.
Affected Part Numbers:
Affected Parts: 105
See part number list in the attachment.
Customer Part Numbers Affected:
Affected Parts: N/A
Qualification Status:
Document No. 001-12089 Rev. *F Page 1 of 1

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