Datasheet 搜索 > 接口芯片 > TI（德州仪器） > DS8921AMX/NOPB 数据手册 > DS8921AMX/NOPB 其他数据使用手册 1/7 页
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DS8921AMX/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
SOIC-8
描述:
DS8921 / DS8921A / DS8921AT差分线路驱动器和接收器对 DS8921/DS8921A/DS8921AT Differential Line Driver and Receiver Pair
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DS8921AMX/NOPB数据手册
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Texas Instruments, Inc. PCN#20150505003
PCN Number:
20150505003
PCN Date:
05/14/2015
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s)
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
08/14/2015
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire
option for devices listed in “Product affected” section below. Devices will remain in current
assembly facilities and there will be no other piece part changes:
Pkg
Family
Current Wire
Additional Wire
SOT23
Au, 1.0 mil
Cu, 0.96 mil
SOIC
Au, 1.0 mil
Cu, 0.96 mil
VSSOP
Au, 1.0 mil
Cu, 0.96 mil
TSSOP
Au, 1.0 mil
Cu, 0.96 mil
QFN
Au, 1.0 mil
Cu, 0.80 mil
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
None
Product Affected:
See Page 2.
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