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DSPIC30F2010-20I/SP 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
MICROCHIP DSPIC30F2010-20I/SP 芯片, 16位20MIPS DSPIC, SPDIP-28
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DSPIC30F2010-20I/SP数据手册
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Date:
23 Aug 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND
Interface; 8-bit Microcontrollers; RF and Security; Analog (Thermal, Power Management & Safety);
Touch Sensing Technologies
Notification subject:
CCB 1155.05 Initial Notification: Qualification of selected products available in the 28L SPDIP, 8L
PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly
site.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_CYER-09HJXI365_Affected_CPN.xls
PCN_CYER-09HJXI365_Affected_CPN.pdf
Description of Change:
Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium
coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the
affected CPN lists (attached) to identify the actual parts affected.
Pre Change:
Gold (Au) wire
Post Change:
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability
Change Implementation Status:
In progress
Estimated First Ship Dates:
October 18, 2013 (Date code: 1342)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
Revision History:
August 23, 2013: Initial notification issue date.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.
Attachment(s):
PCN_CYER-09HJXI365_Affected CPN.pdf
PCN_CYER-09HJXI365_Qual Plan.pdf
PCN_CYER-09HJXI365_Affected CPN.xlsx
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
Product Change Notification - CYER-09HJXI365 (Printer Friendly)
Page 1 of 2Product Change Notification - CYE
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-09HJXI365 - 23 Aug 2013 - CCB 1155.05 Initial N...
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