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DSPIC30F2010-30I/SP 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
dsPIC30 系列 512 B RAM 12 kB 闪存 16位 数字信号控制器 - SDIP-28
Pictures:
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页面导航:
型号编号列表在P3P59
导航目录
DSPIC30F2010-30I/SP数据手册
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of 120 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - GBNG-07ROAS851
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface- LIN
Transceiver; Interface- Passive-Keyless-Entry Analog Front End; Interface- Serial Peripherals;
Binary and BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps;
Linear Programmable Gain Amplifiers; Digital Potentiometers; Dual Slope A/D Converters;
Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive Approximation Register (SAR)
A/D Converters; System D/A Converters; Charge Pump DC-to-DC Converters; Linear Regulators;
Power MOSFET Drivers; Voltage References; Temperature Sensors; Memory; Real-Time
Clock/Calendar; KEELOQ® Decoder Devices; KEELOQ® Encoder Devices; KEELOQ® Transcoder
Devices; USB Bridge; Power Management - PMIC; Power Management - System
Supervisors/Voltage Detectors
Affected CPNs:
Notification subject:
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at
MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site
using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 or G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology
Thailand (Branch)
(MMT)
Wire material
CuPdAu CuPdAu
Die attach material
CRM-1064L CRM-1064L
Molding compound
material
GE800 GE800 G600V
Lead frame material
CDA194 CDA194
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