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DSPIC30F3010-20I/SP 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
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DSPIC30F3010-20I/SP数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
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Date:
10 Oct 2016
Product Category:
Notification subject:
CCB 2734 Final Notice – Implement packing changes without inner box for MSL 1 Microchip
products shipped from all locations.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Virtually all remaining Microchip non dry parts packed in tube and tape & reel (7” and 13”).
Note: Microchip announced to remove the inner box of virtually all products shipped from MTAI in 2009.
Description of Change:
Implement packing changes by removing the inner box for MSL 1 Microchip products packed in tube or tape and
reel.
Pre Change:
MSL 1 packing procedure with inner box (Tape and Reel and Tube packing media)
Post Change:
MSL 1 packing procedure without inner box (Tape and Reel and Tube packing media)
Pre and Post Change Summary:
Pre Change Post Change
MSL 1 Packing Procedure
(tube and tape and reel only)
With Inner box and existing outer box
dimensions.
Without inner box and new box
dimensions that support the inner
box removal.
Impacts to Data Sheet:
No impact anticipated.
Change Impact:
None
Reason for Change:
To Improve Manufacturability
Change Implementation Status:
In Progress
Estimated First Ship Date:
November 1, 2016 (date code: 1645)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change
parts.
Summary Time Table of notable events to date:
October 2016 November 2016
Product Change Notification - KMIO-13LDOL985
Page 1 of 2Product Change Notification - KMIO-13LDOL985 - 10 Oct 2016 - CCB 2734 Final Not
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