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DSPIC30F3011-30I/P
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DSPIC30F3011-30I/P数据手册
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Product Change Notification - GBNG-07ROAS851
Date:
13 Apr 2020
Product Category:
Others; 8-bit Microcontrollers; Touch Controllers; 16-Bit - Microcontrollers and Digital Signal
Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface- LIN
Transceiver; Interface- Passive-Keyless-Entry Analog Front End; Interface- Serial Peripherals;
Binary and BCD A/D Converters; Display A/D Converters; Linear Comparators; Linear Op Amps;
Linear Programmable Gain Amplifiers; Digital Potentiometers; Dual Slope A/D Converters;
Frequency-to-Voltage / Voltage-to-Frequency Converters; Successive Approximation Register (SAR)
A/D Converters; System D/A Converters; Charge Pump DC-to-DC Converters; Linear Regulators;
Power MOSFET Drivers; Voltage References; Temperature Sensors; Memory; Real-Time
Clock/Calendar; KEELOQ® Decoder Devices; KEELOQ® Encoder Devices; KEELOQ® Transcoder
Devices; USB Bridge; Power Management - PMIC; Power Management - System
Supervisors/Voltage Detectors
Affected CPNs:
Notification subject:
CCB 4203 Final Notice: Qualification of G600V as an additional/alternative mold compound material
for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at
MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of G600V as an additional/alternative mold compound material for selected products
available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site
using palladium coated copper wire with gold flash (CuPdAu) bond wire.
Pre Change:
Using GE800 mold compound material.
Post Change:
Using GE800 or G600V mold compound material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch)
(MMT)
Microchip Technology
Thailand (Branch)
(MMT)
Wire material
CuPdAu CuPdAu
Die attach material
CRM-1064L CRM-1064L
Molding compound
material
GE800 GE800 G600V
Lead frame material
CDA194 CDA194

DSPIC30F3011-30I/P 数据手册

Microchip(微芯)
20 页 / 7.79 MByte
Microchip(微芯)
50 页 / 0.69 MByte
Microchip(微芯)
66 页 / 1.52 MByte
Microchip(微芯)
52 页 / 0.06 MByte
Microchip(微芯)
18 页 / 0.3 MByte
Microchip(微芯)
120 页 / 0.32 MByte
Microchip(微芯)
1 页 / 0.14 MByte

DSPIC30F301130 数据手册

Microchip(微芯)
dsPIC30 系列 1 kB RAM 24 kB 闪存 16位 数字信号控制器 - TQFP-44
Microchip(微芯)
MICROCHIP  DSPIC30F3011-30I/P  数字信号控制器, dsPIC30F系列, 40 MHz, 24 KB, 30 输入, I2C, SPI, UART, 5.5 V
Microchip(微芯)
DSPIC30F 数字信号控制器dsPIC30F 数字信号控制器提供 DSP 性能的同时简化了 MCU。 dsPIC30F 最适用于受益于广泛的工作电压(2.5 至 5.5 V)、极低待机电流、集成 EEPROM 的应用以及因系统顾虑而选择 5V 操作的设计师。 30MIPS dsPIC30F 变体集成了 SMPS 外设、电动机控制外设和编解码器接口,为高效数字功率转换器,高级电动机控制算法以及语音和音频应用提供支持。 小封装 DSC具有高性能 ADC,非常适合智能感应应用。### dsPIC® 数字信号控制器
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