Datasheet 搜索 > 微控制器 > Microchip（微芯） > DSPIC30F6012A-30I/PF 数据手册 > DSPIC30F6012A-30I/PF 其他数据使用手册 1/17 页
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DSPIC30F6012A-30I/PF 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-64
描述:
MICROCHIP DSPIC30F6012A-30I/PF 芯片, 16位DSPIC, SMD
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3
导航目录
DSPIC30F6012A-30I/PF数据手册
Page:
of 17 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-23LPHB699
Date:
02 Aug 2019
Product Category:
8-bit Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; 32-bit Microcontrollers
Affected CPNs:
Notification subject:
CCB 3845 and 3845.001 Final Notice: Implement new packing material (non-bakeable tray) for
selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Implement new packing material (non-bakeable tray) for selected Atmel products available in 100L
and 64L TQFP (14x14x1mm) packages at MMT assembly site
Pre Change:
Use of bakeable tray packing material in MSL 3 requirements
Post Change:
Use of non-bakeable tray packing material in MSL 1 requirements
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand (Branch) /
MMT
Microchip Technology
Thailand (Branch) / MMT
MSL Packing
Requirements
MSL 3 MSL 1
Base Quantity Multiple
(BQM) Minimum order
quantity
90units/tray 90units/tray
Assembly Shipping Media
Bakeable Tray Non-Bakeable Tray
Tray Color
Black Blue
Tray Dimension (LxWxH)
322.6x135.9x 20.30 mm 322.6x135.9x 20.30 mm
Tray Photos
See Pre and Post Change attachment for the photo
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability and qualify new packing material (non-bakeable tray) in MSL 1
requirements
Change Implementation Status:
In Progress
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