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DSPIC33EP512GP506-E/MR 其他数据使用手册 - Microchip(微芯)
制造商:
Microchip(微芯)
分类:
微控制器
封装:
QFN-64
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DSPIC33EP512GP506-E/MR数据手册
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若手册格式错乱,请下载阅览PDF原文件

a) Changes to Table 30-3, Table 30-6, Table 30-11, Table 30-14 and Table 30-53.
17) Section 31.0 High Temperature Electrical Characteristics
a) Changes to Table 31-2.
b) Adds Table 31-9, Table 31-10 and Table 31-13.
18) Section 32.0 DC and AC Device Characteristics Graphs
a) Replaces Figure 32-10.
19) Section 33.0 Packaging Information
a) Adds package marking diagram in Section 33.1 Package Marking Information.
b) Adds packaging diagrams to Section 33.2 Package Details.
20) Product Identification System
a) Adds M5 packaging description
Impacts to Data Sheet: None
Reason for Change: To Improve Productivity
Change Implementation Status: Complete
Date Document Changes Effective: 18 June 2020
NOTE: Please be advised that this is a change to the document only the product has not been
changed.
Markings to Distinguish Revised from Unrevised Devices: N/A
Attachment(s):
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, and PIC24EPXXXGP/MC20X Data Sheet
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