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DSPIC33EP512MC504-I/PT 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-44
描述:
MICROCHIP DSPIC33EP512MC504-I/PT 芯片, 数字信号控制器, 16位, 512KB, 70MHZ, 3.6V, TQFP-44
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Product Change Notification - JAON-29UXDQ760 (Printer Friendly)
Date: 08 Jan 2016
Notification subject: CCB 1751 and 1751.01 Final Notice: Qualification of CuPdAu bond wire in selected products of the 0.18um TSMC CUP wafer technology
available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC CUP
wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.
Pre Change:
Gold (Au) or Palladium coated copper wire (PdCu) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI assembly site MTAI assembly site
Wire material Au wire or PdCu wire Au wire or CuPdAu wire
Die attach material 3280 3280
Molding compound material SG-8300ECM or G700HA SG-8300ECM or G700HA
Lead frame material C7025 C7025
Note: SG-8300ECM mold compound can only be used with Au wire. It cannot be used with either of the PdCu wire or CuPdAu wire options
Impacts to Data Sheet:
None
Reason for Change:
To improve on-time delivery performance by qualifying Palladium coated copper with gold flash (CuPdAu) bond wire
Change Implementation Status:
In Progress
Estimated First Ship Date:
January 22, 2016 (date code: 1603)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Summary Table:
October 2015 November 2015 December 2015 January 2016
WW
41 42 43 44 45 46 47 48 49 50 51 52 53 01 02 03 04
Initial PCN Issue
Date
X
Qual Report
Availability
X
Final PCN Issue
Date
X
Implementation
Date
X
a a
a
PRODUCTS APPLICATIONS DESIGN SUPPORT
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Product Change Notification
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JAON
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29UXDQ760
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08 Jan 2016
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CCB 1751 and 1751.0
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2016
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON
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29UXDQ760
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