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DSPIC33EP64MC504-I/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-44
描述:
数字信号处理器和控制器 - DSP, DSC 16b DSC 64KB FL 8KBR 60MHz 44P MCPWMQEI
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DSPIC33EP64MC504-I/ML数据手册
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若手册格式错乱，请下载阅览PDF原文件
Date:
18 Jul 2017
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers; Capacitive Touch Sensors; 32-bit PIC
Microcontrollers
Notification subject:
CCB 3027 Initial Notice: Qualification of CuPdAu bond wire in selected products of the 0.18um
TSMC wafer technology available in 44L QFN package at NSEB assembly
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um
TSMC wafer technology available in 44L QFN package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site NSEB Assembly Site NSEB Assembly Site
Wire material Au Wire CuPdAu Wire
Die attach material 8600 8600
Molding compound material G700LTD G700LTD
Lead frame material C194 C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
January 2018
Note: Please be advised the qualification completion times may be extended because of unforeseen business
conditions however implementation will not occur until after qualification has completed and a final PCN has been
issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the
estimated first ship date guided in the final PCN customers may receive pre and post change parts.
Product Change Notification - KSRA-16BWET454
Page 1 of 2Product Change Notification - KSR
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-16BWET454 - 18 Jul 2017 - CCB 3027 Initial Not
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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