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DSPIC33EV256GM106-I/MR 产品描述及参数 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
描述:
dsPIC33EV 系列 256 kB 闪存 16 kB RAM 16 位 数字信号控制器 -QFN-64
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DSPIC33EV256GM106-I/MR数据手册
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2013-2014 Microchip Technology Inc. DS70005137C-page 1
dsPIC33EVXXXGM00X/10X
1.0 DEVICE OVERVIEW
This document defines the programming specification
for the dsPIC33EVXXXGM00X/10X 16-bit Digital
Signal Controller (DSC) families. This programming
specification is required only for those developing
programming support for the following devices:
Customers only using these devices for application
development should use development tools that
already provide support for device programming.
Topics covered include:
• Section 1.0 “Device Overview”
• Section 2.0 “Programming Overview”
• Section 3.0 “Device Programming – ICSP”
• Section 4.0 “Device Programming – Enhanced
ICSP”
• Section 5.0 “Programming the Programming
Executive to Memory”
• Section 6.0 “The Programming Executive”
• Section 7.0 “Device ID”
• Section 8.0 “Checksum Computation”
• Section 9.0 “AC/DC Characteristics and
Timing Requirements”
2.0 PROGRAMMING OVERVIEW
There are two methods of programming that are
discussed in this programming specification:
• In-Circuit Serial Programming™ (ICSP™)
• Enhanced In-Circuit Serial Programming
The ICSP programming method is the most direct
method to program the device; however, it is also the
slower of the two methods. It provides native, low-level
programming capability to erase, program and verify
the device.
The Enhanced ICSP protocol uses a faster method that
takes advantage of the Programming Executive (PE),
as illustrated in Figure 2-1. The PE provides all the
necessary functionality to erase, program and verify
the chip through a small command set. The com-
mand set allows the programmer to program a
dsPIC33EVXXXGM00X/10X device without dealing
with the low-level programming protocols.
FIGURE 2-1: PROGRAMMING SYSTEM
OVERVIEW FOR
ENHANCED ICSP™
This programming specification is divided into two major
sections that describe the programming methods inde-
pendently. Section 3.0 “Device Programming – ICSP”
describes the ICSP method. Section 4.0 “Device
Programming – Enhanced ICSP” describes the
Enhanced ICSP method.
• dsPIC33EV64GM002 • dsPIC33EV256GM002
• dsPIC33EV64GM004 • dsPIC33EV256GM004
• dsPIC33EV64GM006 • dsPIC33EV256GM006
• dsPIC33EV64GM102 • dsPIC33EV256GM102
• dsPIC33EV64GM104 • dsPIC33EV256GM104
• dsPIC33EV64GM106 • dsPIC33EV256GM106
• dsPIC33EV128GM002
• dsPIC33EV128GM004
• dsPIC33EV128GM006
• dsPIC33EV128GM102
• dsPIC33EV128GM104
• dsPIC33EV128GM106
dsPIC33EVXXXGM00X/10X
Programmer
Programming
Executive
On-Chip Memory
dsPIC33EVXXXGM00X/10X
Flash Programming Specification
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