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DSPIC33FJ128GP706A-I/MR 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
应用领域在P1
型号编号列表在P3P4P5P6P7P8P9
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DSPIC33FJ128GP706A-I/MR数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
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Date:
13 Jun 2016
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers; 32-bit PIC
Microcontrollers
Notification subject:
CCB 2628 Final Notice: Qualification of MTAI assembly site for selected products available in 64L
QFN (9x9x0.9mm) package with 311x311 and 291x291 leadframe paddle size.
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MTAI assembly site for selected products available in 64L QFN (9x9x0.9mm) package with
311x311 and 291x291 leadframe paddle size.
Pre Change:
Assembled at NSEB assembly site
Post Change:
Assembled at NSEB and MTAI assembly site
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site NSEB assembly site NSEB assembly site
MTAI assembly
site
Wire material Au wire Au wire Au wire
Die attach material 8600 8600 3280
Molding compound material G700 G700 G700
Lead frame material EFTECT-64T EFTECT-64T C194
Impacts to Data Sheet:
None
Reason for Change:
To improve productivity by qualifying MTAI assembly site.
Change Implementation Status:
In Progress
Estimated First Ship Date:
July 10, 2016 (date code: 1627)
Product Change Notification - JAON-01PHJW963
Page 1 of 2Product Change Notification - JAON-01PHJW963 - 13 Jun 2016 - CCB 2628 Final Notic...
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