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器件3D模型￥ 56.665
DSPIC33FJ128GP802-E/SP 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
MICROCHIP DSPIC33FJ128GP802-E/SP 芯片, 数字信号控制器(DSC), 16位, 128K闪存, GP, 28SDIP
Pictures:
3D模型
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引脚图
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页面导航:
型号编号列表在P3P59
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DSPIC33FJ128GP802-E/SP数据手册
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Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on time delivery performance by qualifying G600V as an addition/alternative mold
compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of
factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk
not having material to ship.
Change Implementation Status:
In Progress
Estimated First Ship Date:
April 30, 2020 (date code: 2018)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and
post change parts.
Time Table Summary:
April 2020
Workweek
14 15 16 17 18
Final PCN Issue Date X
Estimated Implementation Date
X
Method to Identify Change:
Traceability code
Qualification Plan:
Please open the attachments included with this PCN labeled as PCN_#_Qual_Plan.
Qualification Report:
Qualification Report will be available upon request.
Revision History:
April 13, 2020: Issued final notification.
The change described in this PCN does not alter Microchip's current regulatory compliance
regarding the material content of the applicable products.
Attachment(s):
PCN_GBNG-07ROAS851_Qual_Plan.pdf
Please contact your local Microchip sales office with questions or concerns regarding this
notification.
Terms and Conditions:
If you wish to receive Microchip PCNs via email please register for our PCN email service at our
PCN home page select register then fill in the required fields. You will find instructions about
registering for Microchips PCN email service in the PCN FAQ section.
If you wish to change your PCN profile, including opt out, please go to the PCN home page select
login and sign into your myMicrochip account. Select a profile option from the left navigation bar and
make the applicable selections.
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