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DSPIC33FJ128GP802-I/MM 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-28
描述:
MICROCHIP DSPIC33FJ128GP802-I/MM 芯片, 数字信号控制器, 16位128K闪存, 40MIPS
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DSPIC33FJ128GP802-I/MM数据手册
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若手册格式错乱，请下载阅览PDF原文件
Date:
13 Jul 2017
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers
Notification subject:
CCB 2978 Initial Notice: Qualification of CuPdAu bond wire in selected products of the 0.25um
TSMC wafer technology available in 28L QFN-S package at NSEB assembly site
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um
TSMC wafer technology available in 28L QFN-S package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire, 8200T or 8600 die attach and G770HCD or G700LTD mold compound material.
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound
material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site NSEB Assembly Site NSEB Assembly Site
Wire material Au Wire CuPdAu Wire
Die attach material 8200T 8600 8600
Molding compound material G770HCD G700LTD G700LTD
Lead frame material C194 C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
December 2017
Note: Please be advised the qualification completion times may be extended because of unforeseen business
conditions however implementation will not occur until after qualification has completed and a final PCN has been
issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the
estimated first ship date guided in the final PCN customers may receive pre and post change parts.
Product Change Notification - KSRA-20EIEO658
Page 1 of 2Product Change Notification - KSR
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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