Datasheet 搜索 > 微控制器 > Microchip（微芯） > DSPIC33FJ12MC202-E/SS 数据手册 > DSPIC33FJ12MC202-E/SS 其他数据使用手册 1/6 页
器件3D模型￥ 32.49
DSPIC33FJ12MC202-E/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SSOP-28
描述:
数字信号处理器和控制器 - DSP, DSC 16B Microcontrollers
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
应用领域在P2
型号编号列表在P3P4P5P6
导航目录
DSPIC33FJ12MC202-E/SS数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
Search ...
PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
|| || |
||
Date:
15 Jun 2016
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND
Interface; Radio Frequency Devices; 8-bit Microcontrollers
Notification subject:
CCB 1802 Cancellation Notice: For the qualification of CuPdAu wire, G700LS molding compound
and Ag ring plated leadframe in selected products of the 0.25um TSMC wafer technology in 28L
SSOP at ANAP.
Notification text:
PCN Status:
Cancellation notification
Microchip Parts Affected:
This change would have affected selected products of the 0.25um TSMC wafer technology available in 28L SSOP
package at ANAP assembly site.
Description of Change:
This qualification was originally presented to qualify palladium coated copper with gold flash (CuPdAu) bond wire,
G700LS molding compound and Ag ring plated lead-frame in selected products of the 0.25um TSMC wafer
technology available in 28L SSOP package at ANAP assembly site.
Impacts to Data Sheet:
Not Applicable
Reason for Change:
Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) bond wire, G700LS molding
compound and Ag ring plated lead-frame in selected products of the 0.25um TSMC wafer technology available in
28L SSOP package at ANAP assembly site..
Change Implementation Status:
Not Applicable
Estimated First Ship Date:
Not Applicable
Markings to Distinguish Revised from Unrevised Devices:
Not Applicable
Revision History:
December 03, 2015: Issued initial notification.
June 7, 2016: Issued cancellation notice for the qualification of palladium coated copper with gold flash (CuPdAu)
bond wire, G700LS molding compound and Ag ring plated lead-frame in selected products of the 0.25um TSMC
wafer technology available in 28L SSOP package at ANAP assembly site.
June 15, 2016: Updated reason for change.
Attachment(s):
PCN_JAON-17GAPJ777_Affected_ CPN.pdf
PCN_JAON-17GAPJ777_Affected_ CPN.xls
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
If you wish to change your product/process change notification (PCN) profile please log on to our website at
http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from
the left navigation bar.
Product Change Notification - JAON-17GAPJ777
Page 1 of 2Product Change Notification - JAON-17GAPJ777 - 15 Jun 2016 - CCB 1802 Cancellati
o
...
6
/
16
/
201
6
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-17GAPJ7
7
...
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
