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DSPIC33FJ64GP206A-E/MR 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
Pictures:
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页面导航:
型号编号列表在P4
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DSPIC33FJ64GP206A-E/MR数据手册
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of 17 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-17KNYR589
Date:
24 Jun 2019
Product Category:
Others; 8-bit Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; 32-bit
Microcontrollers
Affected CPNs:
Notification subject:
CCB 3222 Final Notice: Qualification of MMT as an additional assembly site for selected products of
0.25um, 0.18um, 90nm TSMC, 70nm SMIC and 200K wafer technologies available in 64L QFN
(9x9x0.9mm) package.
Notification text:
PCN Status:
Final notification.
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um, 90nm
TSMC, 70nm SMIC and 200K wafer technologies available in 64L QFN (9x9x 0.9mm) package.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI or MMT assembly site.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI)
Microchip
Technology
Thailand HQ
(MTAI)
Microchip
Technology
Thailand
Branch
(MMT)
Wire material
Au Au
Die attach material
3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material
C194 C194
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