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DSPIC33FJ64MC506A-E/MR 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
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DSPIC33FJ64MC506A-E/MR数据手册
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若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-03ASLT650
Date:
25 Jun 2018
Product Category:
8-bit PIC Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; Ethernet
Controllers
Affected CPNs:
Notification subject:
CCB 3221, 3221.001-3221.003 Final Notice: Qualification of MMT as an additional assembly site for
selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L
QFN packages.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change:
Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer
technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.
Pre Change:
Assembled at MTAI assembly site using gold (Au) wire.
Post Change:
Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium
coated copper wire with gold flash (CuPdAu).
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI
Microchip
Technology
Thailand HQ
(MTAI)
Microchip
Technology
Thailand
Branch
(MMT)
Wire material
Au Au CuPdAu
Die attach material
3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material
C194 C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on-time delivery performance by qualifying MMT as an additional assembly site using
palladium coated copper wire with gold flash (CuPdAu).
Change Implementation Status:
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