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EM357-MOD-LR-ANT-C 产品描述及参数 - Silicon Labs(芯科)
制造商:
Silicon Labs(芯科)
分类:
射频接收器
封装:
Module
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3D模型
符号图
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EM357-MOD-LR-ANT-C数据手册
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TS8
Rev 1.4 Copyright © 2015 by Silicon Laboratories TS8
EMBER
®
EM3X MODULE TECHNICAL SPECIFICATION
Silicon Labs’ EM3x development kits contain various modules designed around the EM3x family of ICs. All of these
modules are designed and sold by Silicon Labs’ module partners Telegesis (UK) Limited and California Eastern
Laboratories (CEL). The module designs allow them to be integrated into any product without the need for RF
experience and expertise. Utilizing stacks such as Silicon Labs’ certified ZigBee network stack EmberZNet, these
modules enable a developer to add powerful wireless networking capability to products and quickly bring them to
market.
This document provides the technical specification of the EM3x modules on its Silicon Labs-specific carrier board.
For more information on the other Telegesis modules, contact Telegesis, Ltd directly at www.telegesis.com
. For
more information on other CEL modules, contact CEL directly at meshconnect.cel.com.
New in This Revision
Added CEL CE compliance information.
Contents
1
EM3x Module Definitions ................................................................................................................................. 2
2 EM3x Module Features ................................................................................................................................... 3
3 Performance Characteristics ........................................................................................................................... 3
4 EM3x Configurations ....................................................................................................................................... 5
5 Mechanical Details .......................................................................................................................................... 7
5.1 EM3x Module Interface Connector ........................................................................................................... 8
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