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EP1C6T144C7N 产品封装文件 - Intel（英特尔）
制造商:
Intel（英特尔）
封装:
TQFP-144
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封装尺寸在P1P2P11P12
型号编码规则在P1P6P7P8P9P10
型号编号列表在P1P6P7P8P9P10
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EP1C6T144C7N数据手册
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Altera Corporation 1 02/01/2016 PCN1502
PROCESS CHANGE NOTIFICATION
PCN1502
Package Appearance Change
This is not a new PCN issuance.
PCN1502 Rev 1.2.0 is an update to the list of Ordering Part Numbers (OPNs) affected
(Appendix 1).
Please see the revision history table (page 5) for more details.
Change Description
Altera
®
announces a change to the package appearance on select package types from the
following families of products: APEX
™
, ACEX
®
, FLEX
®
6K, FLEX
®
8K, FLEX
®
10K, MAX
®
3000, MAX
®
7000, MAX
®
II, MAX
®
V, Cyclone
®
, Cyclone
®
III and Cyclone
®
IV. Moving
forward, the mold (assembly process) gate mark will appear on the lower corner of the package
top-side, while the round mold ejector pin marks appearing in the corners of the package bottom-
side will be of a smaller diameter on select packages. See complete details in Figure 1 and
updated Package Drawings in Appendix 2.
There are no changes to device performance, functionality or thermal characteristics. The list of
part numbers affected is available in Appendix 1.
Recommended Action:
Customers are encouraged to review the key milestones listed in the “Product Transition Dates”
section and take the necessary action to approve this change at the earliest. Upon change
implementation (see dates in Table 1), Altera may ship pre-conversion product or post-
conversion product, based on inventory availability.
Revision: 1.2.0
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