Datasheet 搜索 > FPGA芯片 > Altera（阿尔特拉） > EP3C25F324A7N 数据手册 > EP3C25F324A7N 其他数据使用手册 1/6 页
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EP3C25F324A7N 其他数据使用手册 - Altera（阿尔特拉）
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Altera（阿尔特拉）
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FPGA芯片
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FBGA-324
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EP3C25F324A7N数据手册
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Intel Corporation Page 1 of 6 05/26/2017 PCN1705
Revision 1.0.0
PCN Issue Date: 05/26/2017
PROCESS CHANGE NOTIFICATION
PCN1705
Substrate Material Change for Cyclone® III and MAX® II in FBGA-
100/256/324 and UBGA-256 Packages
Change Description:
Intel® Programmable Solutions Group (“Intel PSG”, formerly Altera) is announcing a
change in substrate material for Cyclone III and MAX II products in FBGA-100/245/324
and UBGA-256 packages.
The existing substrate material supplier is discontinuing production of the
halogenated core and prepreg materials for laminated substrate by end of 2017.
The replacement material is already qualified and used in high volume on other FPGA
products for >5 years.
Table 1: Changes to BOM
Change From
Change To
Core and Prepreg Material
Mitsubishi HL832
Mitsubishi HL832NX-A
Mitsubishi HL832EX
Mitsubishi HL832NX-A
Mitsubishi HL832HS
Mitsubishi HL832NX-A
Solder Mask Material
Taiyo AUS 5
Taiyo AUS 308
Taiyo AUS303
Taiyo AUS 308
Note: The rest of the Bill of Materials (BOM) remain the same
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