Datasheet 搜索 > Intel（英特尔） > EP4CE15F17C8 数据手册 > EP4CE15F17C8 产品修订记录 1/6 页
￥ 332.381
EP4CE15F17C8 产品修订记录 - Intel（英特尔）
制造商:
Intel（英特尔）
封装:
BGA-256
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编码规则在P3P5P6
型号编号列表在P3P5P6
导航目录
EP4CE15F17C8数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
Altera Corporation Page 1 of 6 07/15/2016 PCN1604
PCN Issue Date: 07/15/2016
PROCESS CHANGE NOTIFICATION
PCN1604
Material Change for Cyclone® III, Cyclone IV GX, Cyclone IV E
Products in BGA Package
Change Description:
This notification is to announce a change in the Bill of Material (BOM) for Cyclone III, Cyclone
IV GX, Cyclone IV E products in BGA packages.
Table 1:
Material
Change From
Change To
Epoxy Molding
Compound (EMC)
Nitto GE100 series Sumitomo G750 series
Bond Wire Bare Copper Wire
Palladium-Coated Copper (PCC)
Wire
Note: The rest of the BOM remain the same.
Sumitomo G750 molding compound and PCC bond wire materials are both established and
widely used in the industry. These materials are also qualified and already used in other
Altera products.
Recommended Action
Customers are requested to:
1. Acknowledge receipt of this notification.
2. Review the change, and to provide feedback or approval of this change at the earliest
convenience.
Revision: 1.0.0
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
