Datasheet 搜索 > FPGA芯片 > Altera（阿尔特拉） > EP4CE22F17C8L 数据手册 > EP4CE22F17C8L 产品修订记录 1/6 页
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EP4CE22F17C8L 产品修订记录 - Altera（阿尔特拉）
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Altera（阿尔特拉）
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FPGA芯片
封装:
FBGA-256
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EP4CE22F17C8L数据手册
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Altera Corporation Page 1 of 6 07/15/2016 PCN1604
PCN Issue Date: 07/15/2016
PROCESS CHANGE NOTIFICATION
PCN1604
Material Change for Cyclone® III, Cyclone IV GX, Cyclone IV E
Products in BGA Package
Change Description:
This notification is to announce a change in the Bill of Material (BOM) for Cyclone III, Cyclone
IV GX, Cyclone IV E products in BGA packages.
Table 1:
Material
Change From
Change To
Epoxy Molding
Compound (EMC)
Nitto GE100 series Sumitomo G750 series
Bond Wire Bare Copper Wire
Palladium-Coated Copper (PCC)
Wire
Note: The rest of the BOM remain the same.
Sumitomo G750 molding compound and PCC bond wire materials are both established and
widely used in the industry. These materials are also qualified and already used in other
Altera products.
Recommended Action
Customers are requested to:
1. Acknowledge receipt of this notification.
2. Review the change, and to provide feedback or approval of this change at the earliest
convenience.
Revision: 1.0.0
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