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ERG-2SJ471E 其他数据使用手册 - Panasonic（松下）
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Panasonic（松下）
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电阻
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ERG-2SJ471E数据手册
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Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Metal (Oxide) Film Resistors
A
B
Measuring position
25 50 75 1000
+50
+100
+150
+200
+250
Rated Load (%)
Temperature6T (°C)
1S-A
1S-B
12S-A
12S-B
25 50 75 1000
+50
+100
+150
+200
+250
Rated Load (%)
Temperature6T (°C)
2F-A
2S-A
2S-B
2F-B
25 50 75 1000
+50
+100
+150
+200
+250
Rated Load (%)
Temperature6T (°C)
3F-A
3S-A
3S-B
3F-B
25 50 75 1000
+50
+100
+150
+200
+250
Rated Load (%)
Temperature6T (°C)
5F-A
5S-A
5S-B
5F-B
Hot-spot Temperature (for Reference)
The temperature of the resistor body increases with the curve below. A touching vinyl wire may cause damages
to resistor element. Do not place vinyl wires around resistors and be sure to consider where the resistors will be
placed.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors
shown on this catalog.
1. Transient voltage
If there is a possibility that the transient phenomenon (signifi cantly high voltage applied in a short time) may
occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of
Metal(Oxide) Film Resistors (hereafter called the resistors) mounted on your product rath er than only depending
on the calculated pow er limit or steady-state conditions to complete the design or decide to use the resistors.
2. The resistors are covered with a special coating. Do not apply shock or vibration to them, or pinch them with
long-nose pliers. Otherwise, the resistors may be damaged.
3. Do not apply excessive tension to the lead-connect ed sections. When bending the lead wire, do not apply
excessive stress to the resistors and provide the wire with a natural curvature.
4. Do not brush the resistors during or after the cleaning process, which may be conducted after soldering.
Otherwise, the coating fi lm may be damaged.
Aug. 201201
55
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