Datasheet 搜索 > 光耦合器/光隔离器 > ON Semiconductor（安森美） > H11G2M 数据手册 > H11G2M 其他数据使用手册 5/50 页
器件3D模型￥ 2.431
H11G2M 其他数据使用手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
光耦合器/光隔离器
封装:
DIP-6
描述:
ON Semiconductor 光耦 H11G2M, 直流输入, 光电晶体管输出, 6引脚 DIP 封装
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P25P36Hot
封装尺寸在P25P36P46
标记信息在P4P5P11P12P19P25P29P35P45
导航目录
H11G2M数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
THIS FORM PAGE IS TO BE REVISED BY THE NORTHBROOK LABEL DEPARTMENT ONLY
Recognized Component Marking Data Page (RCMDP)
(FILE IMMEDIATELY AFTER AUTHORIZATION PAGE)
RECOGNIZED COMPONENT MARKING
Products Recognized under UL’s Component Recognition Service are identified
by marking elements consisting of:
1. The Recognized Company’s identification specified in this
document.
2. A catalog, model or other applicable product designation
specified in the descriptive sections of this document.
3. The UL Recognized Component Mark shown below:
(A) Recognized only to Canadian safety requirements, or;
(B) Recognized to both U.S. and Canadian safety requirements.
Only those components, which actually bear the Marking, should be considered
as being covered under the Recognition Program. The UL Listing or
Classification Mark is not authorized for use on or in connection with
Recognized Components.
Recognized Component Mark
Minimum size of the Recognized Component Mark is not specified as long as it
is legible. Minimum height of the registered symbol ® shall be 3/64 inch but
may be omitted if it is out of proportion to the Recognized Component Mark or
not legible to the naked eye.
The manufacturer may reproduce the Mark electronically. Any decision
regarding the acceptability of the manufacturer’s Mark reproduction will be
made at the Reviewing Office.
Created by UL Document Assembler 2016-09-13 21:50:29 -05:00
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