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IRF6727M 其他数据使用手册 - Infineon（英飞凌）
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Direct-FET
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IRF6727M数据手册
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DirectFET
®
Technology AN-1035 Board Mounting Application Note
www.irf.com Version 29, June 2016 Page 1 of 44
Application Note AN-1035
DirectFET
®
Technology
Board Mounting Application Note
Table of Contents
Device construction ........................................................ 2
Design considerations .................................................... 3
Assembly considerations ................................................ 4
Mechanical test results ................................................. 10
Appendix A.1 ST-outline ............................................... 16
Appendix A.2 SQ-outline .............................................. 17
Appendix A.3 SJ-outline ............................................... 18
Appendix A.4 SH-outline .............................................. 19
Appendix A.5 S1-outline ............................................... 20
Appendix A.6 S2-outline ............................................... 21
Appendix A.7 SA-outline .............................................. 22
Appendix A.8 SB-outline .............................................. 23
Appendix A.9 SC-outline .............................................. 24
Appendix A.10 S3C-outline .......................................... 25
Appendix A.11 MT-outline ............................................ 26
Appendix A.12 MX-outline ............................................ 27
Appendix A.13 MP-outline ............................................ 28
Appendix A.14 MQ-outline ........................................... 29
Appendix A.15 MN-outline ............................................ 30
Appendix A.16 MZ-outline ............................................ 31
Appendix A.17 MU-outline ............................................ 32
Appendix A.18 M2-outline ............................................ 33
Appendix A.19 M4-outline ............................................ 34
Appendix A.20 MA-outline ............................................ 35
Appendix A.21 MB-outline ............................................ 36
Appendix A.22 MC-outline ............................................ 37
Appendix A.23 MD-outline ............................................ 38
Appendix A.24 ME-outline ............................................ 39
Appendix A.25 MF-outline ............................................ 40
Appendix A.26 L4-outline ............................................. 41
Appendix A.27 L6-outline ............................................. 42
Appendix A.28 L8-outline ............................................. 43
Appendix A.26 LA-outline ............................................. 44
The growing DirectFET range includes various can sizes and device outlines. There are now lead-free variants, identified by a PbF suffix
after the part number (for example, IRF6618PbF). The main text of this application note contains guidance applicable to the whole range,
including lead-free devices. Then, in Appendix A, there are device outlines, substrate layouts and stencil designs for each device (common
to both standard and lead-free variants). For more details about individual devices, refer to the relevant product data sheet and package
outline drawing. To simplify board mounting and improve reliability, International Rectifier manufactures DirectFET devices to exacting
standards. These high standards have evolved through evaluating many different materials and designs. Although such evaluations have
yielded good results, the recommendations in this application note may need to be adjusted to suit specific production environments.
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