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IRF7324D1
器件3D模型
0
导航目录
  • 封装尺寸在P7
  • 标记信息在P7
  • 封装信息在P8
  • 技术参数、封装参数在P1P2
  • 应用领域在P1
  • 电气规格在P2
  • 型号编号列表在P7
IRF7324D1数据手册
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IRF7324D1
FETKY
ä
MOSFET / Schottky Diode
10/18/04
The FETKY family of co-packaged HEXFETs and Schottky diodes offer
the designer an innovative board space saving solution for switching regulator
applications. Generation 5 HEXFETs utilize advanced processing techniques
to achieve extremely low on-resistance per silicon area. Combining this
technology with International Rectifier's low forward drop Schottky rectifiers
results in an extremely efficient device suitable for use in a wide variety of
portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced
thermal characteristics. The SO-8 package is designed for vapor phase,
infrared or wave soldering techniques.
Description
V
DSS
= -20V
R
DS(on)
= 0.27
Schottky Vf = 0.39V
TM
Top View
8
1
2
3
4
5
6
7
A
A
S
G
D
D
K
K
l Co-packaged HEXFET® Power
MOSFET and Schottky Diode
l Ideal for Mobile Phone Applications
l Generation V Technology
l SO-8 Footprint
Notes through are on page 8
SO-8
Absolute Maximum Ratings
Parameter Units
V
DS
Drain-to-Source Voltage V
V
GS
Gate-to-Source Voltage
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
A
I
DM
Pulsed Drain Current
c
P
D
@T
A
= 25°C
Power Dissipation
f
W
P
D
@T
A
= 70°C
Power Dissipation
f
dV/dt
Peak Diode Recovery
d
V/ns
Linear Derating Factor mW/°C
T
J
Operating Junction and °C
T
STG
Storage Temperature Range
Thermal Resistance
Parameter Typ. Max. Units
R
θ
JL
Junction-to-Drain Lead
g
––– 20 °C/W
R
θ
JA
Junction-to-Ambient
fg
––– 62.5
Max.
-2.2
-1.8
-22
± 12
-20
-55 to + 150
2.0
16
1.3
-0.74
PD- 91789B

IRF7324D1 数据手册

International Rectifier(国际整流器)
8 页 / 0.13 MByte

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