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IRF7410
器件3D模型
7.207
导航目录
  • 封装尺寸在P8
  • 标记信息在P8
  • 封装信息在P9
  • 技术参数、封装参数在P1
  • 电气规格在P2
IRF7410数据手册
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Parameter Max. Units
V
DS
Drain- Source Voltage -12 V
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ -4.5V -16
I
D
@ T
A
= 70°C Continuous Drain Current, V
GS
@ -4.5V -13 A
I
DM
Pulsed Drain Current -65
P
D
@T
A
= 25°C Power Dissipation 2.5
P
D
@T
A
= 70°C Power Dissipation 1.6
Linear Derating Factor 20 mW/°C
V
GS
Gate-to-Source Voltage ±8 V
T
J,
T
STG
Junction and Storage Temperature Range -55 to +150 °C
8/2/06
www.irf.com 1
IRF7410
HEXFET
®
Power MOSFET
These P-Channel HEXFET
®
Power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve the extremely low on-resistance
per silicon area. This benefit provides the designer
with an extremely efficient device for use in battery
and load management applications..
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infrared, or wave soldering techniques.
Description
l Ultra Low On-Resistance
l P-Channel MOSFET
l Surface Mount
l Available in Tape & Reel
Parameter Max. Units
R
θJA
Maximum Junction-to-Ambient 50 °C/W
Thermal Resistance
Absolute Maximum Ratings
W
Top View
8
1
2
3
4
5
6
7
D
D
DG
S
A
D
S
S
SO-8
V
DSS
R
DS(on)
max I
D
-12V 7m@V
GS
= -4.5V -16A
9m@V
GS
= -2.5V -13.6A
13m@V
GS
= -1.8V -11.5A
PD - 94025A

IRF7410 数据手册

Infineon(英飞凌)
9 页 / 0.2 MByte
Infineon(英飞凌)
270 页 / 11.59 MByte
Infineon(英飞凌)
9 页 / 0.17 MByte
Infineon(英飞凌)
37 页 / 2.01 MByte
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