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ISL6265CHRTZ-T 产品封装文件 - Renesas Electronics（瑞萨电子）
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Renesas Electronics（瑞萨电子）
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稳压芯片
封装:
TQFN-48
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ISL6265CHRTZ-T数据手册
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PCN20029A
Page 1 of 10
Product Change Notice (PCN)
Subject: Alternate bond wire material and assembly facility of the listed Renesas QFN
packaged products
Publication Date:
Initial PCN : 11/2/2020
Final PCN : 05/21/2021
Effective Date: 8/18/2021
Revision Description:
Initial Release
Revision A : Changes are in RED font.
1. Include Final PCN publication date a
2. Update PCN Effective Date from 07/31/2021 to 08/15/2021
3. Clarification of Final PCN and MSL change after roll out of Copper wire bonding.
4. Update assembly site code for Copper wire assembled at UTL
5. Qualification status has changed from “In Progress” to “Completed”
6. Include disclaimer for sample orders.
7. Update sample availability date 07/05/2021
8. Update affected product list.
9. Update PCN20029 with Reliability Test Result (Appendix B)
Description of Change:
Alternate bond wire material and assembly facility of the listed Renesas QFN packaged
products
- UTAC Thai Ltd., Bangkok, Thailand (UTL)
List of changes :
▪ Table 1 – Adding UTL as alternate assembly site, Wire material change from Gold to Copper
and Standardize Moisture Sensitivity Level to MSL3.
▪ Table 2 - Adding UTL as alternate assembly site.
This notice is an update to PCN20029 (which was published on Nov 02,2020). Renesas
Electronics America (REA) will begin to use UTL as alternate assembly of the listed Renesas
DFN, QFN, TDFN, TQFN package products.
Reason for Change:
The assembly capacity worldwide is in highly competitive space. In order to secure the capacity
ahead, Renesas has qualified the key package families to add alternate sources. These places
will be utilized only if there is a shortfall in the supply. Adding UTL as alternate assembly site
will expand current capabilities and capacities to optimize Renesas’s ability to meet
customer’s delivery requirements. UTL facility is ISO9001:2015 and IATF 16949:2016
certified. UTL is existing assembly supplier for high volume assembly of QFN packaged
products with both gold and copper bond wire material.
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