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LM3485MMX/NOPB
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LM3485MMX/NOPB数据手册
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Texas Instruments, Inc. PCN#20150122001
Qualification Plan Estimated Completion: May, 2015
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Qualification Device: LM3481MM/NOPB (MSL 1-260C)
Package Construction Details
Assembly Site:
ASESH
Mold Compound:
EN2000515
# Pins-Designator, Family:
10-DGK, VSSOP
Mount Compound:
EY1000063
Lead Finish:
NiPdAu, Cu
Bond Wire:
1.3 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size / Fail
Lot 1
Lot 2
Lot 3
High Temp Operating Life
125C (168, 500, 1000 Hours)
77/0
--
--
Electrical Characterization
Side by side
30/0
--
--
**High Temp. Storage Bake
170C (420 Hours)
77/0
--
--
**Biased HAST
130C/85%RH (96 Hours)
77/0
77/0
77/0
**Autoclave 121C
121C, 2 atm (96 Hours)
77/0
77/0
77/0
**T/C -65C/150C
-65C/+150C (500 Cyc)
77/0
77/0
77/0
Notes: **Tests require preconditioning sequence: MSL1-260C
Qualification Plan Estimated Completion: May, 2015
This qualification has been specifically developed for the validation of this change. The qualification data
validates that the proposed change meets the applicable released technical specifications.
Qualification Device: LM3485MM/NOPB (MSL 1-260C)
Package Construction Details
Assembly Site:
ASESH
Mold Compound:
EN2000515
# Pins-Designator, Family:
8-DGK, VSSOP
Mount Compound:
EY1000063
Lead Finish:
NiPdAu, Cu
Bond Wire:
1.0 Mil Dia., Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size / Fail
Lot 1
Lot 2
Lot 3
Electrical Characterization
Side by side
30/0
--
--
**High Temp. Storage Bake
150C (500, 1000 Hours)
77/0
--
--
**Biased Temp. Humidity
85C/85%RH (168, 500, 1000 Hours)
77/0
--
--
**Unbiased HAST
130C/85%RH (96 Hours)
77/0
77/0
77/0
**T/C -65C/150C
-65C/+150C (500 Cyc)
77/0
77/0
77/0
Notes: **Tests require preconditioning sequence: MSL1-260C

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