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LM393P数据手册
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Texas Instruments, Inc. PCN# 20140304002C
PCN Number:
20140304002C
PCN Date:
12/23/2014
Title:
Qualification of HNT and JCET Chuzhou as Additional Assembly/Test Site for Select
Devices
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Revision C is to remove select devices in Group 2 of the Product Affected Section (with
strikethrough) and highlighted in yellow. These devices were inadvertently added and not affected
by this change.
Qualification of HNT and JCET Chuzhou as Additional Assembly/Test Site for Select Devices.
Material differences between Assembly/Test sites as follows:
Group 1 Devices: Assembly Site change only. No Assembly material differences.
Group 2 Devices:
NSE
HANA
Mold Compound
CZ0140
450176
Group 3 Devices :
NFME
JCETCZ
Mold Compound
R-15
013102024401
Wire Type
Au
Cu
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Group1 and 2 Devices:
Assembly Site
NSE Thailand
Assembly Site Origin (22L)
ASO: NSE
Hana Thailand
Assembly Site Origin (22L)
ASO: HNT
ASSEMBLY SITE CODES: NSE =J, HANA =H
Group 3 Devices:
Assembly Site
NFME China
Assembly Site Origin (22L)
ASO: NFM
JCET Chuzhou China
Assembly Site Origin (22L)
ASO: GP6
ASSEMBLY SITE CODES: NFME =E, JCETCZ =F

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