LM7808ACT 其他数据使用手册 - ON Semiconductor（安森美）

Date Created : 2007/11/15

Date Issued On : 2007/11/29

PCN# : Q3073801-A

DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Updated process quality documentation, such as FMEAs and Control Plans, are available for

PCN Originator:

Name: Sun, Brian

E-mail: Brian.Sun@fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/01/29

Earliest Year/Work Week of Changed Product: 0805

Change Type Description: Bond Wire Material Composition, Lead Frame Dimensions (Internal

and External)

Description of Change (From): Current TO-220 heatsink and die attach pad thickness of

different heat sink dimensions in shipments during the transition period.

Reason for Change : Enhancement of leadframe design to improve package mechanical

performance and support additional demand for various TO-220 products to improve our

service to customers. There is insignificant difference in product thermal performance.

Qual/REL Plan Numbers : Q20070208

Qualification :

Passed and meet the FSC rel performance requirement

Change From

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