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LMC6484AIN/NOPB 其他数据使用手册 - TI（德州仪器）
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TI（德州仪器）
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运算放大器
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DIP-14
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TEXAS INSTRUMENTS LMC6484AIN/NOPB 四路运算放大器
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LMC6484AIN/NOPB数据手册
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Texas Instruments, Inc. PCN#20141121003
PCN Number:
20141121003
PCN Date:
12/04/2014
Title:
Qualification of New Mold Compound for selected Devices in the PDIP package
Customer
Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Proposed 1
st
Ship
Date:
3/04/2015
Estimated Sample Availability:
Date provided
upon request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of a new mold compound for the list of
selected PDIP packaged devices shown below.
What
Current
New
Mold Compound
SID#101331374 or SID#8000779
SID#101375725
Reason for Change:
Material Standardization
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
None
Product Affected
ADC0831CCN
LF412ACN
LM2904N/NOPB
LM4562NA/NOPB
ADC0832CCN
LF412CN
LM2904N/SL161612
LM6134BIN
COP431CN
LF442CN/NOPB
LM2907N-8/NOPB
LM6134BIN/NOPB
COP432CN
LF444CN/NOPB
LM2917N-8/NOPB
LM78S40N
DAC0808LCN/SL107322
LM10CN/NOPB
LM2917N/NOPB
LM833N/NOPB
DS14C88N/NOPB
LM13700N
LM311N
LMC6042AIN
DS26LS32ACN
LM231N/NOPB
LM311N/NOPB
LMC6042IN/NOPB
DS26LS32ACN/NOPB
LM2574N-12
LM319N
LMC6044IN
DS3668N
LM2574N-ADJ
LM324AN/NOPB
LMC6044IN/NOPB
DS3668N/HAPB
LM2594N-12/NOPB
LM324AN/PB
LMC6064IN
DS3695N
LM2594N-3.3/NOPB
LM324N/NOPB
LMC6462AIN
DS3695TN
LM2597N-5.0/NOPB
LM339N/NOPB
LMC6462AIN/NOPB
DS75176BN
LM2671N-5.0
LM348N/NOPB
LMC6464BIN
DS8921N/NOPB
LM2671N-ADJ/NOPB
LM3524DN
LMC6482AIN
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