Datasheet 搜索 > 稳压芯片 > TI（德州仪器） > LMS1587CS-3.3/NOPB 数据手册 > LMS1587CS-3.3/NOPB 其他数据使用手册 1/1 页
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LMS1587CS-3.3/NOPB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-263-4
描述:
TEXAS INSTRUMENTS LMS1587CS-3.3/NOPB 固定电压稳压器, LDO, 2.5V至13V, 1.15V压差, 3.3V输出, 3A输出, TO-263-3
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
LMS1587CS-3.3/NOPB数据手册
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若手册格式错乱，请下载阅览PDF原文件
– copper heatsinks with excellent heat conductivity
– direct mounting on printed circuit through solderable surface
– especially suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), D³ PAK (TO 268), SOT 669 LF PAK,
SO IC-8 FL MP, Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc
– available standard packing: loose parts or reel
– special packing like magazine, tray etc. on request
– special versions according to customers specifications
– tape width: 44 mm, reel diameter: 330 mm, quantity: FK 244 08 = 325, FK 244 13 = 200
art. no.
FK 244 08 D PAK ...
weight: 2 g
art. no.
FK 244 13 D PAK ...
weight: 3.3 g
art. no.
FK 244 08 D2 PAK ...
weight: 2.2 g
art. no.
FK 244 13 D2 PAK ...
weight: 3.6 g
art. no.
FK 244 08 D3 PAK ...
weight: 2.5 g
art. no.
FK 244 13 D3 PAK ...
weight: 3.9 g
please indicate:
packing (option)
...
tape and reel=TR
copper (Cu)material:
0.6 mmmaterial thickness:
solderablesurface treatment:
H
HHH
A 54 – 55
➔
High capacity heatsinksC 4 – 9
➔
Heatsinks for transistors
C 17
A 135
➔
Designed parts out of aluminiumC 15 – 16
➔
Heatsinks for TO 5 and TO 18
A 13 - 16
➔
Heatsink profile-overviewC 10 – 14
➔
Attachable heatsinks
A 18 - 20
➔
Classification tableC 2 – 3
➔
Finger-shaped heatsinks
H
Hola1
H
Heatsinks for D PAK and others
H
A
B
C
D
E
F
G
H
I
K
L
M
N
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