Datasheet 搜索 > 微控制器 > NXP（恩智浦） > LPC1758FBD80,551 数据手册 > LPC1758FBD80,551 产品修订记录 1/3 页
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LPC1758FBD80,551 产品修订记录 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
LQFP-80
描述:
NXP LPC1758FBD80,551 芯片, 微控制器, 32位, ARM CORTEX M3, 80LQFP
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标记信息在P1
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LPC1758FBD80,551数据手册
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Final Product Change Notification
202003036F01U01
Issue Date: 07-Jun-2020
Effective Date: 09-Jul-2020
UPDATE
Dear Gordon Love,
Here's your personalized quality information
concerning products Premier Farnell PLC purchased
from NXP.
For detailed information we invite you to view this
notification online
This notice is NXP Company Proprietary.
Management Summary
NXP is changing the packing format from tray to brick for 30 LPC Microcontroller products.
This updated PCN is issued to correct the replacement produt part number for LPC2210FBD144/01
Change Category
[ ] Wafer Fab Process
[ ] Assembly
Process
[ ] Product Marking
[ ] Test
Location
[ ] Design
[ ] Wafer Fab Materials
[ ] Assembly
Materials
[ ] Mechanical Specification
[ ]Test
Process
[ ] Errata
[ ] Wafer Fab Location
[ ] Assembly
Location
[X]
Packing/Shipping/Labeling
[ ] Test
Equipment
[ ] Electrical
spec./Test
coverage
[ ] Firmware
[ ] Other
LPC Microcontroller
Product Tray to Brick
Packing Change
Description of Change
This updated PCN is issued to correct the replacement product part number for LPC2210FBD144/01 in the
affected product list. The 12NC for the replacement part number has been changed to 935282078557 to
reflect the multiple tray packing.
NXP is changing the packing format from single-tray to 5-tray (brick) for 30 LPC Microcontroller products.
This will result in the creation of new part numbers to order and new Minimum Order Quantities (MOQs). A
complete list with the new orderable part numbers, including the new packing and MOQ, is attached for your
reference.
There is no change to the products, only the packing method and packing quantity.
The Distributor Price Book has been updated with new part numbers.
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