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Advance Product Change Notification 201506013A
Issue Date: 08-Feb-2016
Dear Product Change Notices Newark,
Here’s your personalized quality information concerning products
Newark purchased from NXP.
For detailed information we invite you to view this notification online
picture
Management Summary
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80 and TFBGA100 packages.
Add Powerchip as a new FAB. Add SPIL as an additional assembly site for the LQFP100 and LQFP80
packages.
Change Category
[ ] Wafer Fab process [X] Assembly Process [X] Product Marking [X] Design
[ ] Wafer Fab
materia
l
s
l
s
[ ] Ele
c
trical spec./T
e
s
t co
v
era
g
e
[ ]
Mechan
i
c
a
l Specificati
o
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[X] Wafer F
a
b locati
o
n
[X] Assembly Location
[ ] Test Locat
i
on
[ ] Packing/Shippi
n
g/Labe
l
ing
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80, TFBGA100
packages
Details of this Planned Change
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80 and TFBGA100 packages.
- No change in data sheet
- No change in ordering part number / 12NC
- Final test location remains unchanged at NXP Assembly and Test Kaohsiung (ATKH)
The silicon wafers are currently produced in SSMC. This qualification will enable producing the silicon wafers at the
Powerchip FAB (PTCF12).
The die revision will be changed from Rev 6 to Rev 11 which includes design changes.
The die pad has been optimized to allow for Cu wire bonding.
ATKH will be qualified for the LQFP100, LQFP80 and TFBGA100 packages with the following changes:

LPC1768FBD100,551 数据手册

NXP(恩智浦)
2 页 / 1.84 MByte
NXP(恩智浦)
851 页 / 4.36 MByte
NXP(恩智浦)
90 页 / 1.39 MByte
NXP(恩智浦)
93 页 / 1.77 MByte
NXP(恩智浦)
3 页 / 0.07 MByte

LPC1768 数据手册

NXP(恩智浦)
ARM Cortex-M3 Microcontrollers, NXP基于 NXP ARM Cortex-M3 的微控制器,适用于嵌入式应用,具有高集成水平并提供系统增强功能,例如低功耗、增强调试功能和更高级别的块集成支持。Cortex-M3 核可最高以 150 MHz 运行 高达 512KB 的闪存和高达 64KB 的片上 SRAM 低功耗,用于 LPC13xx 设备时低至 200μA/MHz 新唤醒中断控制器 (WIC)、套放向量中断控制器 (NVIC) 和存储器保护装置 配有先进的外围设备,如以太网、USB 主机/OTG/设备、CAN、IS、快速模式 Plus (Fm+) IC、12 位 ADC、电机控制 PWM、正交编码器接口和其他。 ### ARM Cortex 微控制器,NXP
NXP(恩智浦)
NXP(恩智浦)/LPC1768FBD100 托盘
NXP(恩智浦)
NXP  LPC1768FET100,551.  微控制器, 32位, ARM 皮质-M3, 100 MHz, 512 KB, 64 KB, 100 引脚, TFBGA
NXP(恩智浦)
ARM微控制器 - MCU 512kB flash, 64kB SRAM, Ethernet, USB, LQFP100 package
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Embest
LPC1768-SK是一个新手套件用于NXP LPC1768 ARM Cortex-M处理器. LPC1768是一个Cortex-M3微控制器, 用于内嵌型应用, 具有高度集成性和低功率消耗, 运行频率100MHz.套件包含所有必要的硬件和软件, 用于可设计, 开发, 集成和测试其应用程序. LPC1768电路板包括单芯片LPC17xx系统系统所需的所有硬件元件. Emlink的ARM是一新一代高速实时JTAG适配器, 通过Keil Real view MDK和IAR EWARM调试ARM Cortex-M3处理器. Emlink将JTAG从目标电路板 (ARM处理器)连接至电脑USB端口, 支持源级别调试和闪存编程.
NXP(恩智浦)
32位ARM Cortex -M3微控制器;高达512 KB的闪存和64 KB的SRAM,带有以太网 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 64 kB SRAM with Ethernet
NXP(恩智浦)
ARM微控制器 - MCU ARM Cortex-M3 MCU
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