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LPC1768FBD100,551 产品修订记录 - NXP(恩智浦)
制造商:
NXP(恩智浦)
分类:
微控制器
封装:
LQFP-100
描述:
ARM Cortex-M3 Microcontrollers, NXP基于 NXP ARM Cortex-M3 的微控制器,适用于嵌入式应用,具有高集成水平并提供系统增强功能,例如低功耗、增强调试功能和更高级别的块集成支持。Cortex-M3 核可最高以 150 MHz 运行 高达 512KB 的闪存和高达 64KB 的片上 SRAM 低功耗,用于 LPC13xx 设备时低至 200μA/MHz 新唤醒中断控制器 (WIC)、套放向量中断控制器 (NVIC) 和存储器保护装置 配有先进的外围设备,如以太网、USB 主机/OTG/设备、CAN、IS、快速模式 Plus (Fm+) IC、12 位 ADC、电机控制 PWM、正交编码器接口和其他。 ### ARM Cortex 微控制器,NXP
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LPC1768FBD100,551数据手册
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1
Advance Product Change Notification 201506013A
Issue Date: 08-Feb-2016
Dear Product Change Notices Newark,
Here’s your personalized quality information concerning products
Newark purchased from NXP.
For detailed information we invite you to view this notification online
picture
Management Summary
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80 and TFBGA100 packages.
Add Powerchip as a new FAB. Add SPIL as an additional assembly site for the LQFP100 and LQFP80
packages.
Change Category
[ ] Wafer Fab process [X] Assembly Process [X] Product Marking [X] Design
[ ] Wafer Fab
materia
l
s
[X] Assembly Materia
l
s
[ ] Ele
c
trical spec./T
e
s
t co
v
era
g
e
[ ]
Mechan
i
c
a
l Specificati
o
n
[X] Wafer F
a
b locati
o
n
[X] Assembly Location
[ ] Test Locat
i
on
[ ] Packing/Shippi
n
g/Labe
l
ing
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80, TFBGA100
packages
Details of this Planned Change
Dual sourcing of the LPC175X/6X products in the LQFP100, LQFP80 and TFBGA100 packages.
- No change in data sheet
- No change in ordering part number / 12NC
- Final test location remains unchanged at NXP Assembly and Test Kaohsiung (ATKH)
The silicon wafers are currently produced in SSMC. This qualification will enable producing the silicon wafers at the
Powerchip FAB (PTCF12).
The die revision will be changed from Rev 6 to Rev 11 which includes design changes.
The die pad has been optimized to allow for Cu wire bonding.
ATKH will be qualified for the LQFP100, LQFP80 and TFBGA100 packages with the following changes:
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