器件3D模型

￥ 82.273

LPC1778FBD208,551 产品修订记录 - NXP（恩智浦）

制造商:

NXP（恩智浦）

分类:

微控制器

封装:

LQFP-208

描述:

NXP LPC1778FBD208,551 微控制器, 32位, ARM 皮质-M3, 120 MHz, 512 KB, 96 KB, 208 引脚, LQFP

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LPC1778FBD208,551数据手册

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Final Product Change Notification

202003036F01U01

Issue Date: 07-Jun-2020

Effective Date: 09-Jul-2020

UPDATE

Dear Gordon Love,

Here's your personalized quality information

concerning products Premier Farnell PLC purchased

from NXP.

For detailed information we invite you to view this

notification online

This notice is NXP Company Proprietary.

Management Summary

NXP is changing the packing format from tray to brick for 30 LPC Microcontroller products.

This updated PCN is issued to correct the replacement produt part number for LPC2210FBD144/01

Change Category

[ ] Wafer Fab Process

[ ] Assembly

Process

[ ] Product Marking

[ ] Test

Location

[ ] Design

[ ] Wafer Fab Materials

[ ] Assembly

Materials

[ ] Mechanical Specification

[ ]Test

Process

[ ] Errata

[ ] Wafer Fab Location

[ ] Assembly

Location

[X]

Packing/Shipping/Labeling

[ ] Test

Equipment

[ ] Electrical

spec./Test

coverage

[ ] Firmware

[ ] Other

LPC Microcontroller

Product Tray to Brick

Packing Change

Description of Change

This updated PCN is issued to correct the replacement product part number for LPC2210FBD144/01 in the

affected product list. The 12NC for the replacement part number has been changed to 935282078557 to

reflect the multiple tray packing.

NXP is changing the packing format from single-tray to 5-tray (brick) for 30 LPC Microcontroller products.

This will result in the creation of new part numbers to order and new Minimum Order Quantities (MOQs). A

complete list with the new orderable part numbers, including the new packing and MOQ, is attached for your

reference.

There is no change to the products, only the packing method and packing quantity.

The Distributor Price Book has been updated with new part numbers.

￥ 82.273

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LPC1778FBD208,551 数据手册

NXP（恩智浦）

2 页 / 0.69 MByte

LPC1778FBD208,551 产品设计参考手册

NXP（恩智浦）

1110 页 / 5.64 MByte

LPC1778FBD208,551 其他数据使用手册

NXP（恩智浦）

126 页 / 2.29 MByte

LPC1778FBD208,551 产品设计图

NXP（恩智浦）

2 页 / 1.06 MByte

LPC1778FBD208,551 产品修订记录

NXP（恩智浦）

3 页 / 0.17 MByte

LPC1778 数据手册

NXP（恩智浦）

32位ARM Cortex -M3微控制器 32-bit ARM Cortex-M3 microcontroller

LPC1778FBD208,551 数据手册

NXP（恩智浦）

NXP LPC1778FBD208,551 微控制器, 32位, ARM 皮质-M3, 120 MHz, 512 KB, 96 KB, 208 引脚, LQFP

LPC1778FBD144,551 数据手册

NXP（恩智浦）

NXP LPC1778FBD144,551 微控制器, 32位, ARM 皮质-M3, 120 MHz, 512 KB, 96 KB, 144 引脚, LQFP

LPC1778FBD208 数据手册

NXP（恩智浦）

NXP LPC1778FBD208 微控制器, 32位, ARM 皮质-M3, 120 MHz, 512 KB, 96 KB, 208 引脚, LQFP

LPC1778FET208,551 数据手册

NXP（恩智浦）

ARM Cortex 微控制器，NXP

LPC1778FET180,551 数据手册

NXP（恩智浦）

ARM Cortex-M3 Microcontrollers, NXP基于 NXP ARM Cortex-M3 的微控制器，适用于嵌入式应用，具有高集成水平并提供系统增强功能，例如低功耗、增强调试功能和更高级别的块集成支持。Cortex-M3 核可最高以 150 MHz 运行高达 512KB 的闪存和高达 64KB 的片上 SRAM 低功耗，用于 LPC13xx 设备时低至 200μA/MHz 新唤醒中断控制器 (WIC)、套放向量中断控制器 (NVIC) 和存储器保护装置配有先进的外围设备，如以太网、USB 主机/OTG/设备、CAN、IS、快速模式 Plus (Fm+) IC、12 位 ADC、电机控制 PWM、正交编码器接口和其他。 ### ARM Cortex 微控制器，NXP

LPC1778FBD144 数据手册

NXP（恩智浦）

NXP(恩智浦)/LPC1778FBD144 托盘

LPC1778FBD144K 数据手册

NXP（恩智浦）

ARM Cortex-M3 120MHz 闪存：512K@x8bit RAM：96KB

LPC1778FBD208K 数据手册

NXP（恩智浦）

ARM Cortex-M3 120MHz 闪存：512K@x8bit RAM：96KB

LPC1778FET208 数据手册

NXP（恩智浦）

NXP LPC1778FET208 微控制器, 32位, ARM 皮质-M3, 120 MHz, 512 KB, 96 KB, 208 引脚, TFBGA