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LPC2364FBD100,551 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
SOT-407-1
描述:
NXP LPC2364FBD100,551 芯片, 32位微控制器, ARM7, 10/100, USB, CAN
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
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标记信息在P1
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LPC2364FBD100,551数据手册
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Customer Information Notification
202011011I : NXP Will Add a Sealed Date to the Product Label
Note: This notice is NXP Company Proprietary.
Issue Date: Dec 15, 2020 Effective date:Dec 16, 2020
Here is your personalized notification about a NXP general announcement.
For detailed information we invite you to view this notification online
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PCN Overview
Description
NXP announces a change to its Standard Product Label. On January 7th, 2021 NXP will add a
Sealed Date to the Product Label in the format of DDMMMYY as a visible data field on the Product
label. This change will be visible on all MSL level 2 and above product package in a Moisture Barrier
bag requiring desiccant packs with a minimum shelf life of 12 months.
ZVEI DeQuMa SEM-PS-04
Reason
Align NXP Product label in accordance with industry standard IPC/JEDEC J-STD-033D.
Identification of Affected Products
Product identification does not change
The Seal Date will not be bar coded or included as a data element in the 2D bar code.
Anticipated Impact on Form, Fit, Function, Reliability or Quality
No Impact on form, fit, function, reliability or quality
Disposition of Old Products
Existing inventory will be shipped until depleted
Both the new and the old PQ box labeling will be shipped in parallel for a certain transition period
until all finished product inventories are consumed in NXP warehouse stocks.
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