Datasheet 搜索 > NXP（恩智浦） > LPC2368FBD100K 数据手册 > LPC2368FBD100K 其他数据使用手册 1/86 页
器件3D模型￥ 59.324
LPC2368FBD100K 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
封装:
LQFP-100
描述:
单片机(MCU/MPU/SOC) LPC2368FBD100K LQFP-100(14x14)
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P1
导航目录
LPC2368FBD100K数据手册
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若手册格式错乱，请下载阅览PDF原文件
Customer Information Notification
202011011I : NXP Will Add a Sealed Date to the Product Label
Note: This notice is NXP Company Proprietary.
Issue Date: Dec 15, 2020 Effective date:Dec 16, 2020
Here is your personalized notification about a NXP general announcement.
For detailed information we invite you to view this notification online
Change Category
[ ]Wafer
Fab
Process
[ ]Assembly
Process
[ ]Product Marking
[ ]Test
Process
[ ]Design
[ ]Wafer
Fab
Materials
[ ]Assembly
Materials
[ ]Mechanical Specification
[ ]Test
Equipment
[ ]Errata
[ ]Wafer
Fab
Location
[ ]Assembly
Location
[X]Packing/Shipping/Labeling
[ ]Test
Location
[ ]Electrical
spec./Test
coverage
[ ]Firmware
[ ]Other
PCN Overview
Description
NXP announces a change to its Standard Product Label. On January 7th, 2021 NXP will add a
Sealed Date to the Product Label in the format of DDMMMYY as a visible data field on the Product
label. This change will be visible on all MSL level 2 and above product package in a Moisture Barrier
bag requiring desiccant packs with a minimum shelf life of 12 months.
ZVEI DeQuMa SEM-PS-04
Reason
Align NXP Product label in accordance with industry standard IPC/JEDEC J-STD-033D.
Identification of Affected Products
Product identification does not change
The Seal Date will not be bar coded or included as a data element in the 2D bar code.
Anticipated Impact on Form, Fit, Function, Reliability or Quality
No Impact on form, fit, function, reliability or quality
Disposition of Old Products
Existing inventory will be shipped until depleted
Both the new and the old PQ box labeling will be shipped in parallel for a certain transition period
until all finished product inventories are consumed in NXP warehouse stocks.
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