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MAX13234EETP+T 其他数据使用手册 - Maxim Integrated（美信）
制造商:
Maxim Integrated（美信）
分类:
接口芯片
封装:
WQFN-20
描述:
收发器 250Kbps
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
MAX13234EETP+T数据手册
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若手册格式错乱，请下载阅览PDF原文件
E = Number of Pins category E (16 pins)
Please note that suffix codes are not always consistent across different product
types. Always refer to the data sheet for details and specifications.
Temperature Ranges
A Automotive AEC-Q100 Grade
1
-40°C to +125°C
C Commercial 0°C to +70°C
E Extended -40°C to +85°C
G Automotive AEC-Q100 Grade
2
-40°C to +105°C
I Industrial -20°C to +85°C
M Military -55°C to +125°C
T Automotive AEC-Q100 Grade
0
-40°C to +150°C
U Upper Commercial 0°C to +85°C
Package Type
A SSOP (Shrink Small Outline Package) 209 mil (14, 16, 20, 24, 28 leads); 300 mil
(36 leads)
B UCSP (Ultra-Small Chip Scale Pkg)
C PLASTIC TO-92; TO-220
C LQFP 1.4mm (7mm x 7mm thru 20mm x 20mm)
C TQFP 1.0mm (7mm x 7mm thru 20mm x 20mm)
D CERAMIC SIDEBRAZE 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40, 48
leads)
E QSOP (Quarter Small Outline Package)
F CERAMIC FLATPACK
G METAL CAN (Gold)
G QFN (Plastic, Very Thin, Quad Flat No Lead - Punch Version) 0.9mm
H SBGA (Super Ball Grid Array)
H TQFP 1.0mm 5mm x 5mm (32 leads)
Maxim Product Naming Conventions - Maxim
4/14/201
6
https://www.maximintegrated.com/en/design/packaging/packag
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