Datasheet 搜索 > 接口芯片 > TI（德州仪器） > MAX3222CDB 数据手册 > MAX3222CDB 其他数据使用手册 1/9 页
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MAX3222CDB 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
SSOP-20
描述:
3V至5.5V多通道RS-232收发器
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MAX3222CDB数据手册
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若手册格式错乱，请下载阅览PDF原文件
MAX3222
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
SLLS408C – JANUARY 2000 – REVISED AUGUST 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
D
Operates With 3-V to 5.5-V V
CC
Supply
D
Operates up to 250 kbit/s
D
Two Drivers and Two Receivers
D
Low Standby Current ...1 µA Typical
D
External Capacitors ...4 × 0.1 µF
D
Accepts 5-V Logic Input With 3.3-V Supply
D
Designed to Be Interchangeable With
Maxim MAX3222
D
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
D
Applications
– Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication
controller and the serial-port connector. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate.
The MAX3222 can be placed in the power-down mode by setting PWRDOWN
low, which draws only 1 µA from
the power supply. When the device is powered down, the receivers remain active while the drivers are placed
in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to
V
CC
, and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting
EN
high.
ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC (DW)
Tube MAX3222CDW
MAX3222C
0°Cto70°C
SOIC
(DW)
Tape and reel MAX3222CDWR
MAX3222C
–
0°C
to
70°C
SSOP (DB) Tape and reel MAX3222CDBR MA3222C
TSSOP (PW) Tape and reel MAX3222CPWR MA3222C
SOIC (DW)
Tube MAX3222IDW
MAX3222I
40°Cto85°C
SOIC
(DW)
Tape and reel MAX3222IDWR
MAX3222I
–
40°C
to
85°C
SSOP (DB) Tape and reel MAX3222IDBR MB3222I
TSSOP (PW) Tape and reel MAX3222IPWR MB3222I
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DB, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
EN
C1+
V+
C1–
C2+
C2–
V–
DOUT2
RIN2
ROUT2
PWRDOWN
V
CC
GND
DOUT1
RIN1
ROUT1
NC
DIN1
DIN2
NC
NC – No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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