Datasheet 搜索 > 接口芯片 > TI（德州仪器） > MAX3232MPWREP 数据手册 > MAX3232MPWREP 产品修订记录 6/9 页
器件3D模型￥ 19.436
MAX3232MPWREP 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
TSSOP-16
描述:
TEXAS INSTRUMENTS MAX3232MPWREP 收发器, RS232, 2驱动器, 3V-5.5电源, TSSOP-16
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
电气规格在P3
导航目录
MAX3232MPWREP数据手册
Page:
of 9 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20120822000A
Qual Vehicle 3 : CDCE706PWR (MSL1-260C)
Package Construction Details
Assembly Site:
TI Malaysia
Mold Compound:
4211471
# Pins-Designator, Family:
20-PW, SOIC
Mount Compound:
4211470
Lead frame (Finish, Base):
NiPdAu, Cu
Bond Wire:
0.80 Mil Diameter, Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size / Fail
Lot#1
Lot#2
Lot#3
Electrical Characterization
-
Pass
-
-
*High Temp. Storage Bake
170C (420 hrs)
77/0
77/0
77/0
*Autoclave 121C
121C, 2 atm (96 Hrs)
77/0
77/0
77/0
*T/C -65C/150C
-65C/+150C (500 Cycle)
77/0
77/0
77/0
Manufacturability
(per mfg. Site specification)
Pass
Pass
Pass
Moisture Sensitivity
(level 1 @ 260C peak +5/-0C)
12/0
12/0
12/0
Notes: * Preconditioning sequence: Level 1-260C.
Qual Vehicle 4 : E8722DGG (MSL1-260C)
Package Construction Details
Assembly Site:
TI Malaysia
Mold Compound:
4211471
# Pins-Designator, Family:
64-DDG, TSSOP
Mount Compound:
4211470
Lead frame (Finish, Base):
NiPdAu, Cu
Bond Wire:
1.15 Mil Diameter, Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size / Fail
Lot#1
Lot#2
*High Temp. Storage Bake
170C (420 hrs)
77/0
77/0
*Autoclave 121C
121C, 2 atm (96 Hrs)
77/0
77/0
*T/C -65C/150C
-65C/+150C (500 Cycle)
77/0
77/0
Flammability
Method A - UL94V-0
5/0
-
Flammability
Method B - IEC 695-2-2
5/0
-
Flammability
Method C – UL1694
5/0
-
Manufacturability
(per mfg. Site specification)
Pass
Pass
Moisture Sensitivity
(level 1 @ 260C peak +5/-0C)
12/0
12/0
Notes: * Preconditioning sequence: Level 1-260C.
Qual Vehicle 5: SN0610001DGGR (MSL2-260C)
Package Construction Details
Assembly Site:
TI Taiwan
Mold Compound:
4211471
# Pins-Designator, Family:
48-DGG, TSSOP
Mount Compound:
4211470
Lead frame (Finish, Base):
NiPdAu, Cu
Bond Wire:
0.96 Mil Diameter, Au
Qualification: Plan Test Results
Reliability Test
Conditions
Sample Size / Fail
Lot#1
Lot#2
Lot#3
*High Temp. Storage Bake
170C (420hrs)
77/0
77/0
77/0
*Autoclave 121C
121C, 2 atm (96 Hrs)
77/0
77/0
77/0
*T/C -65C/150C
-65C/+150C (500 Cycle)
77/0
77/0
77/0
*Biased Temp and Humidity
85C/85%RH (1000 Hrs)
77/0
77/0
77/0
Manufacturability
(per mfg. Site specification)
Pass
Pass
Pass
Moisture Sensitivity
(level 2 @ 260C peak +5/-0C)
12/0
-
-
Notes: * Preconditioning sequence: Level 2-260C.
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
