Datasheet 搜索 > DA转换器 > Maxim Integrated（美信） > MAX525BCPP+ 数据手册 > MAX525BCPP+ 其他数据使用手册 3/7 页
器件3D模型￥ 74.508
MAX525BCPP+ 其他数据使用手册 - Maxim Integrated（美信）
制造商:
Maxim Integrated（美信）
分类:
DA转换器
封装:
DIP-20
描述:
MAXIM INTEGRATED PRODUCTS MAX525BCPP+ 数模转换器, 低功率, 12 bit, 串行, 4.5V 至 5.5V, DIP, 20 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
MAX525BCPP+数据手册
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若手册格式错乱，请下载阅览PDF原文件
H TSSOP (Thin Shrink Small Outline Package) 4.4mm (8 leads)
J CERDIP (Ceramic Dual-Inline) (N) 300 mil (8, 14, 16, 18, 20 leads); (W) 600 mil
(24, 28, 40 leads)
K SOT 1.23mm (8 Leads)
L LCC (Leadless Ceramic Chip Carrier) (18, 20, 28 leads)
L FCLGA (Flip Chip Land Grid Array); THIN LGA (Thin Land Grid Array) 0.8mm
L µDFN (Micro Dual Flat No Lead) (6, 8, 10 leads)
M MQFP (Metric Quad Flat Pack) over 1.4mm; ED-QUAD (28mm x 28mm 160
leads)
N PDIP (Narrow Plastic Dual-Inline) 300 mil (24, 28 leads)
P PDIP (Plastic Dual-Inline) 300 mil (8, 14, 16, 18, 20 leads); 600 mil (24, 28, 40
leads)
Q PLCC (Plastic Leaded Chip Carrier)
R CERDIP (Narrow Ceramic Dual-Inline) 300 mil (24, 28 leads)
S SOIC (Narrow Plastic Small Outline) 150 mil
T METAL CAN (Nickel)
T TDFN (Plastic, Very Very Thin, Dual Flat No Lead - Sawn Version) 0.9mm (6, 8,
10, 14 leads)
T THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
TQ THIN QFN (Plastic, Very Very Thin, Quad Flat No Lead - Sawn Version) 0.8mm
(8 leads)
U SOT 1.23mm (3, 4, 5, 6 leads)
U TSSOP (Thin Shrink Small Outline Package) 4.4mm (14, 16, 20, 24, 28, 38, 56
leads); 6.1mm (48 leads)
U µMAX (Thin Shrink Small Outline Package) 3mm x 3mm (8, 10 leads)
V U. TQFN (Ultra Thin QFN -Plastic Ultra Thin Quad Flat No Lead - Sawn version)
0.55mm
W SOIC (Wide Plastic Small Outline) 300 mil
W WLP (Wafer Level Pkg)
X CSBGA 1.4mm
X CVBGA 1.0mm
Maxim Product Naming Conventions - Maxim
4/14/201
6
https://www.maximintegrated.com/en/design/packaging/packag
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