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MBRS3100T3 产品设计图 - ON Semiconductor(安森美)
制造商:
ON Semiconductor(安森美)
分类:
整流二极管
封装:
DO-214AB
描述:
表面贴装肖特基整流电源 Surface Mount Schottky Power Rectifier
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
焊盘布局在P1P2
标记信息在P1
导航目录
MBRS3100T3数据手册
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of 2 Go
若手册格式错乱,请下载阅览PDF原文件

DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.13 2.41 0.075
INCHES
A1 0.05 0.10 0.15 0.002
b 2.92 3.00 3.07 0.115
c 0.15 0.23 0.30 0.006
D 5.59 5.84 6.10 0.220
E 6.60 6.86 7.11 0.260
L 0.76 1.02 1.27 0.030
0.084 0.095
0.004 0.006
0.118 0.121
0.009 0.012
0.230 0.240
0.270 0.280
0.040 0.050
NOM MAX
7.75 7.94 8.13 0.305 0.313 0.320
H
E
SMC
CASE 403−03
ISSUE E
DATE 03 AUG 200
5
xxxx = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
GENERIC
MARKING DIAGRAM*
4.343
0.171
3.810
0.150
2.794
0.110
ǒ
mm
inches
Ǔ
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
bD
c
L1L
A1
A
AYWW
xxxxG
G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.
SCALE 1:1
H
E
0.020 REF
0.51 REF
L1
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASB42668B
ON SEMICONDUCTOR STANDARD
SMC
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
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