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MC01W08051330R
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MC01W08051330R数据手册
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Page <1> V1.025/07/13
Thick Film Chip Resistor
0805
Features
Small size and light weight
Suitable for both wave and reow soldering
Reduction of assembly costs
Performance Specication
Temperature Coefcient : 1Ω to 10Ω ±400PPM/°C
11Ω to 100Ω ±200PPM/°C
>100Ω ±100PPM/°C
Short Time Overload : ±5% : ±(2% +0.1Ω)Max.
±1% : ±(1% +0.1Ω)Max.
Insulation Resistance : Min. 1,000MΩ
Dielectric Withstanding Voltage : No evidence of ashover, mechanical damage,
arcing or insulation breakdown.
Terminal Bending : ±(1% +0.05Ω) Max.
Soldering Heat : ±(1% +0.05Ω) Max.
Solderability : Min. 95% coverage
Temperature Cycling : ±5% : ±(1% +0.05Ω) Max.
±1% : ±(0.5% +0.05Ω) Max.
Humidity (Steady State) : ±5% : ±(3% +0.1Ω) Max.
±1% : ±(0.5% +0.1Ω) Max.
Load Life in Humidity : ±5% : ±(3% +0.1Ω) Max.
±1% : ±(1% +0.1Ω) Max.
Load Life : ±5% : ±(3% +0.1Ω) Max.
±1% : ±(1% +0.1Ω) Max.
Derating Curve

MC01W08051330R 数据手册

Multicomp
5 页 / 0.25 MByte
Multicomp
14 页 / 0.6 MByte
Multicomp
1 页 / 0.14 MByte

MC01W08051330 数据手册

Multicomp
MULTICOMP  MC01W08051330K  片式电阻器, 表面贴装, 厚膜, MC系列, 330 kohm, 150 V, 0805 [2012公制], 100 mW, ± 1%
Multicomp
MULTICOMP  MC01W08051330R  片式电阻器, 表面贴装, 厚膜, MC系列, 330 ohm, 150 V, 0805 [2012公制], 100 mW, ± 1%
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