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MC100EP809MNG
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MC100EP809MNG数据手册
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QFN32 5x5, 0.5P
CASE 488AM
ISSUE A
DATE 23 OCT 2013
SCALE 2:1
SEATING
NOTE 4
K
0.15 C
(A3)
A
A1
D2
b
1
9
17
32
XXXXXXXX
XXXXXXXX
AWLYYWWG
G
1
GENERIC
MARKING DIAGRAM*
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
E2
32X
8
L32X
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A
B
E
0.15 C
ÉÉ
ÉÉ
PIN ONE
LOCATION
0.10 C
0.08 C
C
25
e
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
32
1
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
PLANE
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
3.35
0.30
3.35
32X
0.63
32X
5.30
5.30
(Note: Microdot may be in either location)
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
ÉÉ
ÉÉ
ÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL B
DETAIL A
DIM
A
MIN
MILLIMETERS
0.80
A1 −−−
A3 0.20 REF
b 0.18
D 5.00 BSC
D2 2.95
E 5.00 BSC
2.95
E2
e 0.50 BSC
0.30
L
K
0.20
1.00
0.05
0.30
3.25
3.25
0.50
−−−
MAX
−−−
L1
0.15
e/2
NOTE 3
PITCH
DIMENSION: MILLIMETERS
RECOMMENDED
A
M
0.10 BC
M
0.05 C
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON20032D
ON SEMICONDUCTOR STANDARD
QFN32 5x5 0.5P
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2

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