Web Analytics
Datasheet 搜索 > 接口芯片 > ON Semiconductor(安森美) > MC1496P 数据手册 > MC1496P 产品设计图 1/3 页
MC1496P
6.577
导航目录
  • 封装尺寸在P1
  • 焊盘布局在P1P3
  • 标记信息在P1P3
MC1496P数据手册
Page:
of 3 Go
若手册格式错乱,请下载阅览PDF原文件
SOIC−14 NB
CASE 751A−03
ISSUE L
DATE 03 FEB 201
6
SCALE 1:1
1
14
GENERIC
MARKING DIAGRAM*
XXXXXXXXXG
AWLYWW
1
14
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
*This information is generic. Please refer t
o
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
STYLES ON PAGE 2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
H
14
8
71
M
0.25 B
M
C
h
X 45
SEATING
PLANE
A1
A
M
_
S
A
M
0.25 B
S
C
b
13X
B
A
E
D
e
DETAIL A
L
A3
DETAIL A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
A 1.35 1.75 0.054 0.068
b 0.35 0.49 0.014 0.019
L 0.40 1.25 0.016 0.049
e 1.27 BSC 0.050 BSC
A3 0.19 0.25 0.008 0.010
A1 0.10 0.25 0.004 0.010
M 0 7 0 7
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
__ __
6.50
14X
0.58
14X
1.18
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASB42565B
ON SEMICONDUCTOR STANDARD
SOIC−14 NB
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 3

MC1496P 数据手册

ON Semiconductor(安森美)
14 页 / 0.32 MByte
ON Semiconductor(安森美)
4 页 / 0.06 MByte
ON Semiconductor(安森美)
3 页 / 0.03 MByte
ON Semiconductor(安森美)
12 页 / 0.12 MByte

MC1496 数据手册

ON Semiconductor(安森美)
ON SEMICONDUCTOR  MC1496DR2G  芯片, 平衡调制/解调器, 14SOIC
ON Semiconductor(安森美)
ON SEMICONDUCTOR  MC1496DG  芯片, 调制解调器, SMD
ON Semiconductor(安森美)
MC1496 平衡调制器/解调器**MC1496** 平衡调制器/解调器的输出电压是输入电压(信号)和切换功能(载体)的产品。载体抑制:-65dB @ 0.5MHz,-50dB @ 10MHz 可调增益和信号处理 平衡输入和输出 共模抑制:-85dB 典型 工作温度范围:0 至 +70°C (**MC1496**),-40 to +125°C (**MC1496B**) 应用:抑制载体和振幅调制,同步检测,FM 检测,相位检测 **RS 产品代码** 463-640 MC1496DG 787-8715 MC1496BDG 787-8712 MC1496DR2G 787-8718 MC1496BDR2G ### Single-Chip Components, ON Semiconductor
ON Semiconductor(安森美)
ON SEMICONDUCTOR  MC1496PG  芯片, 平衡式调制解调器
ON Semiconductor(安森美)
MC1496 平衡调制器/解调器**MC1496** 平衡调制器/解调器的输出电压是输入电压(信号)和切换功能(载体)的产品。载体抑制:-65dB @ 0.5MHz,-50dB @ 10MHz 可调增益和信号处理 平衡输入和输出 共模抑制:-85dB 典型 工作温度范围:0 至 +70°C (**MC1496**),-40 to +125°C (**MC1496B**) 应用:抑制载体和振幅调制,同步检测,FM 检测,相位检测 **RS 产品代码** 463-640 MC1496DG 787-8715 MC1496BDG 787-8712 MC1496DR2G 787-8718 MC1496BDR2G ### Single-Chip Components, ON Semiconductor
ON Semiconductor(安森美)
ON SEMICONDUCTOR  MC1496BPG  通信电路
ON Semiconductor(安森美)
平衡调制器/解调器 BALANCED MODULATORS/DEMODULATORS
ON Semiconductor(安森美)
平衡调制器/解调器 BALANCED MODULATORS/DEMODULATORS
ON Semiconductor(安森美)
平衡调制器/解调器 BALANCED MODULATORS/DEMODULATORS
ON Semiconductor(安森美)
平衡调制/解调器
器件 Datasheet 文档搜索
器件加载中...
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件