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MC33067数据手册
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PDIP−16
CASE 648−08
ISSUE V
DATE 22 APR 2015
SCALE 1:1
XXXXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
GENERIC
MARKING DIAGRAM*
16
1
XXXXXXXXXXXX
XXXXXXXXXXXX
AWLYYWWG
16
1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
18
16 9
b2
NOTE 8
D
A
TOP VIEW
E1
B
b
L
A1
A
C
SEATING
PLANE
0.010 CA
SIDE VIEW
M
16X
D1
e
A2
NOTE 3
M
B
M
eB
E
END VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM MIN MAX
INCHES
A −−−− 0.210
A1 0.015 −−−−
b 0.014 0.022
C 0.008 0.014
D 0.735 0.775
D1 0.005 −−−−
e 0.100 BSC
E 0.300 0.325
M −−−− 10
−− 5.33
0.38 −−
0.35 0.56
0.20 0.36
18.67 19.69
0.13 −−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −− 10.92
0.060 TYP 1.52 TYP
c
A2 0.115 0.195 2.92 4.95
L 0.115 0.150 2.92 3.81
°°
H
NOTE 5
NOTE 6
M
e/2
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASB42431B
ON SEMICONDUCTOR STANDARD
PDIP−16
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
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