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MC34064D-5R2 其他数据使用手册 - ON Semiconductor（安森美）
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ON Semiconductor（安森美）
分类:
电源监控芯片
封装:
SOIC-8
描述:
欠压检测电路 UNDERVOLTAGE SENSING CIRCUIT
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封装尺寸在P29P30
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技术参数、封装参数在P2P3P4P5P6P7P8P9P10P11P12P13
电气规格在P3P4P5P6P7P8P12
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MC34064D-5R2数据手册
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© Freescale Semiconductor, Inc., 2005. All rights reserved.
Freescale Semiconductor
Technical Data
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
MC145170-2/D
Rev. 5, 1/2005
MC145170-2
SCALE 2:1
Package Information
D Suffix
Plastic DIP Package
Case 751B
Package Information
DT Suffix
TSSOP Package
Case 948C
Package Information
P Suffix
SOG Package
Case 648
Ordering Information
Device
Operating
Temperature Range
Package
MC145170P2
T
A
= -40 to 85°C
Plastic DIP
MC145170D2 SOG-16
MC145170DT2 TSSOP-16
1 Introduction
The new MC145170-2 is pin-for-pin compatible with the
MC145170-1. A comparison of the two parts is shown in
Table 1 on page 2. The MC145170-2 is recommended
for new designs and has a more robust power-on reset
(POR) circuit that is more responsive to momentary
power supply interruptions. The two devices are actually
the same chip with mask options for the POR circuit. The
more robust POR circuit draws approximately 20 µA
additional supply current. Note that the maximum
specification of 100 µA quiescent supply current has not
changed.
The MC145170-2 is a single-chip synthesizer capable of
direct usage in the MF, HF, and VHF bands. A special
architecture makes this PLL easy to program. Either a
bit- or byte-oriented format may be used. Due to the
patented BitGrabber™ registers, no address/steering bits
are required for random access of the three registers.
Thus, tuning can be accomplished via a 2-byte serial
transfer to the 16-bit N register.
MC145170-2
PLL Frequency Synthesizer with
Serial Interface
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Electrical Characteristics . . . . . . . . . . . . . . . 3
3 Pin Connections . . . . . . . . . . . . . . . . . . . . . . . 9
4 Design Considerations . . . . . . . . . . . . . . . . 18
5 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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