Datasheet 搜索 > 微控制器 > NXP（恩智浦） > MC56F8013VFAE 数据手册 > MC56F8013VFAE 产品修订记录 1/2 页
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MC56F8013VFAE 产品修订记录 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
LQFP-32
描述:
NXP MC56F8013VFAE 芯片, 16位混合信号控制器
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MC56F8013VFAE数据手册
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Customer Information Notification
202002019I
Issue Date: 14-Feb-2020
Effective Date: 15-Feb-2020
Dear Gordon Love,
Here's your personalized quality information
concerning products Premier Farnell PLC purchased
from NXP.
For detailed information we invite you to view this
notification online
This notice is NXP Company Proprietary.
Change Category
[ ] Wafer Fab Process
[ ] Assembly
Process
[ ] Product Marking
[ ] Test
Location
[ ] Design
[ ] Wafer Fab Materials
[ ] Assembly
Materials
[ ] Mechanical Specification
[ ]Test
Process
[ ] Errata
[ ] Wafer Fab Location
[ ] Assembly
Location
[X]
Packing/Shipping/Labeling
[ ] Test
Equipment
[ ] Electrical
spec./Test
coverage
[ ] Firmware
[ ] Other
Converting inner
packing carton boxes
from ATTJ to ATKL
Description
NXP ATTJ is to temporarily use the NXP ATKL inner packing box, which shares the same drawing and
manufactured by ATKL box vender, to address the carton box supply shortage.
The temporary solution's period will last around 1 month, starting from Feb 15, 2020
Reason
As the current coronavirus situation in China, the NXP ATTJ packing box's supplier (International paper)
could not guarantee on-time delivery. Consequently, NXP ATTJ would like to purchase and use the
packing carton box which currently supplies NXP ATKL as a temporary solution to address any packing
box supply shortage.
Anticipated Impact on Form, Fit, Function, Reliability or Quality
Disposition of Old Products
Only the boxes will be coming from a different supplier. The actual devices are not changing at all.
Additional information
Affected products and sales history information: see attached file
Additional documents: view online
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